G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip StdPbc-0220 This Test Method covers the

This Test Method covers the simultaneous determination of total oxygen

SEMI E90 — Specification for Substrate Tracking

and 16 nm technology generation as anticipated by the International Technology Roadmap for Semiconductors (ITRS) and in the forecasts of the major manufacturers of semiconductor devices

本文件包含下列章節：

SEMI MF1727-1110 (technical revision)

G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip StdPbc-0220 This Test Method covers theThis Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1994. NOTICE: This Document was reapproved with minor editorial changes. This Guideline details recommendations for a standardized thermal test chip design for